Ƙarƙashin Bayanan Bayani na Copper (VLP-SP/B)

Sub-micron micro-roughening jiyya yana ƙaruwa sosai a sararin samaniya ba tare da yin tasiri ba, wanda ke taimakawa musamman don ƙara ƙarfin mannewa.


Cikakken Bayani

Tags samfurin

Sub-micron micro-roughening jiyya yana ƙaruwa sosai a sararin samaniya ba tare da yin tasiri ba, wanda ke taimakawa musamman don ƙara ƙarfin mannewa.Tare da babban mannewar barbashi, babu damuwa da barbashi fadowa kashe da kuma gurbata Lines.Ana kiyaye ƙimar Rzjis bayan roughening a 1.0 µm kuma gaskiyar fim ɗin bayan an yi shi shima yana da kyau.

Daki-daki

Kauri: 12um 18um 35um 50um 70um
Daidaitaccen Nisa: 1290mm, Nisa Nisa: 200-1340mm, na iya zama yankan gwargwadon buƙatun girman.
Kunshin akwatin katako
ID: 76 mm, 152 mm
Tsawon: Na musamman
Ana iya samar da samfur

Siffofin

Foil ɗin da aka kula da shi shine ruwan hoda ko baƙar fata na jan ƙarfe na electrolytic mai ƙarancin ƙarancin ƙasa.Idan aka kwatanta da foil na jan ƙarfe na electrolytic na yau da kullun, wannan foil ɗin VLP yana da mafi kyawun lu'ulu'u, waɗanda suke daidai da waɗanda ke da ƙugiya masu lebur, suna da ƙarancin saman 0.55μm, kuma suna da irin wannan cancantar azaman mafi girman kwanciyar hankali da taurin mafi girma.Wannan samfurin yana da amfani ga maɗaukaki da kayan aiki masu sauri, galibi masu sassauƙan allunan kewayawa, babban allon kewayawa, da allunan kewayawa masu kyau.
Ƙarƙashin bayanin martaba
Babban darajar MIT
Kyakkyawan etchability

Aikace-aikace

2Layer 3 Layer FPC
EMI
Kyakkyawan tsarin kewayawa
Wayar hannu Cajin mara waya
Babban allon mita

Hannun kaddarorin na Foil ɗin Rubutun Ƙarƙashin Ƙarfafa

Rabewa

Naúrar

Bukatu

Hanyar Gwaji

Kauri mara kyau

Um

12

18

35

50

70

Saukewa: IPC-4562A

Nauyin yanki

g/m²

107± 5

153± 7

285± 10

435± 15

585± 20

IPC-TM-650 2.2.12.2

Tsafta

%

≥99.8

IPC-TM-650 2.3.15

m

Side mai haske (Ra)

sa

≤0.43

IPC-TM-650 2.3.17

Gefen Matte (Rz)

um

≤3.0

≤3.0

≤3.0

≤3.0

≤3.0

Ƙarfin Ƙarfin Ƙarfi

RT(23°C)

Mpa

≥300

IPC-TM-650 2.4.18

HT(180°C)

≥180

Tsawaitawa

RT(23°C)

%

≥5

≥6

≥8

≥10

≥10

IPC-TM-650 2.4.18

HT (180 ° C

≥6

≥6

≥6

≥6

≥6

Ƙarfin Kwasfa (FR-4)

N/mm

≥0.8

≥0.8

≥1.0

≥1.2

≥1.4

IPC-TM-650 2.4.8

lbs/in

≥4.6

≥4.6

≥5.7

≥6.8

≥8.0

Pinholes & Porosity Lambobi

No

IPC-TM-650 2.1.2

Anti-oxidization RT(23°C) Days

180

 
HT (200°C)

Mintuna

30

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5G Babban Mitar Board Ultra Low Profile Copper Foil1

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