Rufin Tagulla na Gefe Biyu Don HDI
●Kauri: 12um 18um 35um 70um
●Standard Nisa: 1290mm, Za mu iya yanka a matsayin size da ake bukata
●ID: 76 mm, 152 mm
●Tsawon: Na musamman
●Ana iya samar da samfurin;Lokacin jagora: 7days
●Lokacin bayarwa: 15-20days
●Cikakkun bayanai: Fitar da Akwatin katako
●Lokaci: FOB, CIF.
●Abun biyan kuɗi: 50% T / T ajiya, biyan kuɗi kafin jigilar kaya.
●Babban aikin sarrafa kayan aikin zubar da kayan aiki yana yin aikin ƙirƙira na foil ɗin tagulla.
●Rufin tagulla mai gefe biyu
●Tare da babban ɗaurin ƙarfi don laminate
●Kai tsaye Multi-Lamination Lamination
●Kyakkyawan etchability
●Tsawon foil ɗin da aka yiwa magani ruwan hoda ne
●Multilayer Printed Board
●HDI (High Density Interconnector) don PCB
| Rabewa | Naúrar | Bukatu | Hanyar Gwaji | ||||||
| Tsare-tsare |
| T | H | 1 | 2 | Saukewa: IPC-4562A | |||
| Kauri mara kyau | um | 12 | 18 | 35 | 70 | Saukewa: IPC-4562A | |||
| Nauyin yanki | g/m² | 107±5 | 153± 7 | 285± 10 | 585± 20 | IPC-TM-650 2.2.12 | |||
| Tsafta | % | ≥99.8 | IPC-TM-650 2.3.15 | ||||||
| Rrashin kunya | Side mai haske (Ra) | um | ≤3.0 | Saukewa: IPC-TM-6502.2.17 | |||||
| Gefen Matte (Rz) | um | ≤6 | ≤8 | ≤10 | ≤15 | ||||
| Ƙarfin Ƙarfin Ƙarfi | RT(23°C) | Mpa | ≥207 | ≥207 | ≥276 | ≥276 | IPC-TM-650 2.4.18 | ||
| H.T.(180°C) | ≥103 | ≥103 | ≥138 | ≥138 | |||||
| Tsawaitawa | RT(23°C) | % | ≥2 | ≥2 | ≥3 | ≥3 | IPC-TM-650 2.4.18 | ||
| H.T.(180°C) | ≥2 | ≥2 | ≥2 | ≥3 | |||||
| Resistivity | Ωg/m² | ≤0.170 | ≤0.166 | ≤0.162 | ≤0.162 | Saukewa: IPC-TM-6502.5.14 | |||
| Ƙarfin Kwasfa (FR-4) | S gefe | N/mm | ≥0.9 | ≥0.9 | ≥1.4 | ≥1.4 | IPC-TM-650 2.4.8 | ||
| lbs/in | ≥5.1 | ≥6.3 | ≥8.0 | ≥8.0 | |||||
| M gefe | N/mm | ≥0.9 | ≥1.1 | ≥1.4 | ≥2.0 | ||||
| lbs/in | ≥5.1 | ≥6.3 | ≥8.0 | ≥11.4 | |||||
| Pinholes & porosity | Lambas | No | IPC-TM-650 2.1.2 | ||||||
| Anti-oxidization | RT(23°C) | Kwanaki | 180 | / | |||||
| H.T.(200°C) | Mintuna | 40 | / | ||||||
Daidaitaccen Nisa, 1295 (± 1) mm, Nisa Nisa: 200-1340mm.Maiyu bisa ga tela mai buƙatun abokin ciniki.
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